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dev dutt on ML Focus Shifting Toward Software.Santosh Prajapati on Data Security Challenges In Automotive.Mark D LaPedus on Week In Review: Manufacturing, Test.Nicolas Baron on Next-Gen 3D Chip/Packaging Race Begins.Jacek Tyminski on Power Optimization: What’s Next?.Allen Rasafar on Critical Moves: Advanced Logic Devices And CIS Benefit From Applications Using IRCD Metrology.Bessel Func on What Causes Semiconductor Aging?.David Leary on What Causes Semiconductor Aging?.Habib Hichri on Why Data Center Power Will Never Come Down.My2cents on Spreadsheets: Still Valuable, But More Limited.Craig Franklin on Future Challenges For Advanced Packaging.Alex Voronel on Technology Advances, Shortages Seen For Wire Bonders.Conrad Chompff on Why Data Center Power Will Never Come Down.Martin Buehring on Unknowns Driving Up The Cost Of Auto IC Reliability.Ed Sperling on Why Data Center Power Will Never Come Down.Ray Barrett on Unknowns Driving Up The Cost Of Auto IC Reliability.Jan Hoppe on What Causes Semiconductor Aging?.Mark LaPedus on Technology Advances, Shortages Seen For Wire Bonders.Tanj Bennett on Thermal Management Implications For Heterogeneous Integrated Packaging.Arnaud PHELIPOT on What Causes Semiconductor Aging?.Mark LaPedus on Next-Gen 3D Chip/Packaging Race Begins.Rajeev Vadjikar on Transistors Reach Tipping Point At 3nm.Dale on Automotive Functional Safety Compliance In EDA Tools And IP.

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Infineon’s Michael Ebli describes how to overcome temperature and endurance challenges in servo drive design.Īnsys’ Anthony Dawson and Jane Trenaman list reasons to integrate the simulation tools used by different teams.Ĭadence’s Paul McLellan takes a look at some of the many ways to stack chips.Ģ.5D 5G 7nm AI ANSYS Apple Applied Materials ARM Atrenta automotive business Cadence EDA eSilicon EUV finFETs GlobalFoundries Google IBM IMEC Intel IoT IP Lam Research machine learning memory Mentor Mentor Graphics Moore's Law Nvidia NXP OneSpin Solutions Qualcomm Rambus Samsung security SEMI Siemens Siemens EDA software Sonics Synopsys TSMC UMC verification Rambus’ Frank Ferro explains why the same aspects that make GDDR ideal for demanding 3D graphics can boost edge inference, too. Synopsys’ Gary Ruggles lays out three major changes in PCIe 6.0 that designers need to consider.Īrm’s Travis Walton and Udi Maor urge the industry to fix memory safety bugs and vulnerabilities before they become a big problem. Siemens EDA’s Harry Foster points to increased design size as only one dimension of the growing complexity challenge. Plus, catch up on the blogs featured in the latest Low Power-High Performance newsletter: ON Semiconductor’s Oriol Fillo considers slow charging times one of the last hurdles for widespread electric vehicle adoption and looks at AC/DC conversion, calculating charging rates and times, and key aspects of fast DC charging. SEMI’s Heidi Hoffman surveys how companies responded to the COVID-19 pandemic, including adoption of digital technologies and what positions are still working remotely.Īpplied Materials’ Regina Freed examines issues in logic cell layout optimization and pattern variability which must be addressed to enable continued improvements in logic area-cost scaling, power, and performance. Infineon’s Peter Friedrichs examines the interplay of failures in time rates and gate-oxide reliability in silicon carbide MOSFETs and how to screen to reduce reliability risks. Siemens’ Florian Götz finds embedded software development is becoming more fundamental to today’s vehicles and looks at the process of application development and quality assurance.Ī Synopsys writer looks at the difference in how memory mapped registers are placed and accessed in the CXL 1.1 and CXL 2.0 specification and explains how to access them in CXL 2.0.Īnsys’ Sean Patterson shows how high-fidelity simulation of lidar designs can provide an in-depth understanding of edge cases and assist optimization, virtual benchmarking, and package analysis. Arm’s Adrian Herrera explores the latest version of AMBA ATP Engine, an open-source implementation of the AMBA Adaptive Traffic Profiles (ATP) synthetic traffic framework specification, which adds the ability to program AMBA ATP traffic generation from Linux environments.Ĭadence’s Paul McLellan finds out just how effective glitching chips is by delivering incorrect voltages and clock frequencies, and the implications for security.